Jana Ficeriová, Peter Baláž and Eberhard Gock: Leaching of gold, silver and accompanying metals from circuit boards (PCBs) waste 130 0 60 120 180 240 300 360 420 480 0 20 40 60 80 ε 100 Me [ % ] Ni Al Fe Cu Zn t L [ min ] Fig. 1. Recovery of Zn, Cu, Fe, Al and Ni, εMe vs. leaching time, tL for circuit boards (PCBs) waste pretreated
Silver recovery by chemical leaching depends on the heating of the film in the solution of oxalic acid (H 2 C 2 O 4 ), nitric acid (HNO 3 ), sodium hydroxide (NaOH), at boiling temperature for the separation of the inorganic component from the polymer layer.
Leaching from silver sulfide using a copper-thiosulfate solution in the absence of ammonia was investigated. It is found that silver sulfide could be effectively dissolved in the copper-thiosulfate system without ammonia. The effects of thiosulfate concentration, copper- to-thiosulfate ratio ...
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